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SF305 is highly flexible, allowing it to conform to irregular shapes and fit into tight spaces. SF305 is lightweight and thin, making it easier to incorporate into compact designs. It also has excellent thermal stability and can withstand high temperatures. It is suitable for use in high-temperature environments. SF305 is highly reliable, with low signal loss and high signal integrity, making it a popular choice for high-speed data transfer applications.
MV Flex Circuit ensures that flexible PCBs are optimized for their intended application, with a deep understanding of the unique challenges and requirements of designing for flexibility and durability.
Allowing customers to evaluate the flex PCB before committing to larger orders. With rigorous testing and quality control processes, MV Flex Circuit ensures that products meet high-performance standards.
MV Flex Circuit can meet tight deadlines and deliver high-quality flex PCBs on time with a streamlined production process and responsive customer support.
MV Flex Circuit offers competitive pricing for Shengyi SF305, ensuring that customers receive high-quality flex PCBs at an affordable price.
By leveraging their expertise and advanced manufacturing capabilities, MV Flex Circuit can offer cost-effective solutions without sacrificing the quality or reliability of products.
We provide excellent customer support, working closely with customers to ensure they receive the right product for their needs and addressing any concerns or questions they may have.
MV Flex Circuit can help you get the best price if you send us your Gerber files. Our engineering team will provide a quotation within 1-2 hours. Even if we cannot provide the offer, our sales team will keep you informed of the status via email. Please don’t hesitate to contact us, as we are always here to help.
This is a three-layer flexible copper-clad laminate (CCL) made by Shengyi Technology Co., Ltd. This advanced CCL is designed for flexible printed circuit boards that require excellent electrical performance, mechanical stability, and thermal resistance.
This material features a polyimide substrate that provides outstanding flexibility and resistance to high temperatures, along with a thin, uniform layer of copper that delivers superior electrical conductivity. Its three-layer construction allows for greater design flexibility, enabling the creation of intricate circuitry with multiple layers.
This material is a halogen-free polyimide film-based copper-clad laminate with superior performance in flexible printed circuit board applications. The halogen-free polyimide film provides excellent flexibility and thermal stability. It is ideal for use in harsh environments.
Thanks to its thin, uniform copper layer, the material is designed to deliver high electrical conductivity and mechanical stability. This copper-clad laminate is ideal for various applications, including automotive electronics, consumer electronics, and industrial control systems.
Welcome to our FAQ section, where we’ve compiled answers to many commonly asked questions. If you have any additional queries, please leave us a message.
This material offers a range of advantages, including high flexibility, excellent high-temperature resistance, low dielectric loss, and high signal integrity. It is also lightweight and thin, making it easy to incorporate into compact designs.
This material is designed to withstand high temperatures, with a maximum operating temperature of up to 150 degrees Celsius.
This table shows its available properties.
| Test Item | Treatment Condition | Unit | Property Data | ||
| IPC Standard | Typical Value | ||||
| 051813DR | 051813SE | ||||
| Peel Strength | 288°C, 5s | N/mm | ≥0.7-0.5 | 1.0 – 1.1 | 1.2 – 1.3 |
| Folding Endurance | R0.8×4.9N | Times | – | >600 | >350 |
| Thermal Stress | 300°C, 30s | – | – | No delamination | No delamination |
| Dimensional Stability | E-0.5/150 | % | ±0.2 | ±0.1 | ±0.1 |
| Chemical Resistance | After Chemical Exposure | % | ≥80 | >85 | >85 |
| Dielectric Constant | C-24/23/50 | – | ≤4.0 | 3.6 | 3.6 |
| Dissipation Factor | C-24/23/50 | – | ≤0.04 | 0.031 | 0.030 |
| Volume Resistivity | C-96/35/90 | MΩ -cm | ≥10⁶ | 1.5×10⁸ | 2.0×10⁸ |
| Surface Resistance | C-96/35/90 | MΩ | ≥10⁵ | 5.0×10⁶ | 4.5×10⁶ |
Yes, this material is EU RoHS compatible. It restricts the use of certain hazardous substances. It is also used in electrical and electronic equipment.
This material meets the requirements of this regulation, ensuring that it is safe and environmentally friendly. As a supplier of Shengyi SF305, MV Flex Circuit ensures that all of its products are RoHS compliant and meet the highest standards of safety and quality.
UL94 V-0 is a flammability rating that indicates a material’s resistance to combustion, and Shengyi SF305 has explicitly been tested and certified to meet this standard. This certification confirms that the material is highly resistant to flame and combustion, making it a safe and reliable choice for applications where fire safety is a concern.
Shengyi SF305 is certified to IPC-4204/2 Copper Clad Polyimide Dielectric with Epoxy Adhesive. This certification indicates that the material meets the rigorous standards set forth by the IPC (Institute of Printed Circuits) for copper-clad polyimide laminates with an epoxy adhesive layer.
Shengyi SF305 is a versatile and reliable flex PCB material used in many applications. Its high-temperature resistance, excellent electrical properties, and robust mechanical properties make it well-suited for computers, mobile phones, digital cameras, VCRs, OA equipment, etc.
SF305 is often used in applications where space and weight are at a premium, as its flexibility allows for compact designs, and its durability ensures long-lasting performance. Its compatibility with various manufacturing processes, including surface mount technology (SMT) and through-hole technology (THT), makes it a popular choice for many applications.
