Menu
Take your product performance to the next level with the advanced technology of multilayer flex PCBs. Upgrade your circuit design with flexible and reliable printed circuit boards that are designed to improve efficiency, reduce downtime, and enhance overall performance. With the latest innovations in multilayer flex PCB manufactured in MV Flex Circuits, you can trust that your products will reach their full potential.
MV Flex Circuit Adheres to strict industry standards for quality and reliability of each multilayer PCB manufactured to meet every client needs.
We invest in the latest equipment and technology to produce multilayer flex PCB that are highly accurate, reliable, and efficient. Utilizes advanced technology and manufacturing processes.
Has a team of experienced and knowledgeable experts to ensure each PCB is up to standards, checking from designing, lay-out, manufacturing to shipping.
MV Flex Circuit have the resources, equipment, and expertise to produce boards in a timely and efficient manner, which helps reduce project lead times.
We are committed to customer satisfaction and providing exceptional service. MV Flex Circuits can provide a personalized and customized solutions for every client.
We continuously invests in research and development to stay ahead of the latest technology advancements that’s why we offer flexible and durable multilayer flex PCBs.
MV Flex Circuit can help you get the best price if you send us your Gerber files. Our engineering team will provide a quotation within 1-2 hours. Even if we cannot provide the offer, our sales team will keep you informed of the status via email. Please don’t hesitate to contact us, as we are always here to help.
Multilayer flex PCBs are a cutting-edge technology in the world of circuit design.
These flexible printed circuit boards are made up of multiple layers of conductive material, allowing for a higher density of interconnections and a more efficient circuit design. The added flexibility allows for greater freedom in product design, making these type of flex PCBs an ideal solution for a wide range of applications.
With advancements in technology and manufacturing processes, these type of flex PCBs are becoming an increasingly popular choice for circuit design, offering improved performance and reliability for a wide range of products.
Multilayer flex PCBs and multilayer rigid PCBs both offer the ability to have multiple layers of conductive material in a circuit design. However, the key difference lies in their flexibility.
Multilayer rigid PCBs are made up of rigid, non-flexible materials, while multilayer flex PCBs have a flexible substrate that allows for more versatility in product design. This flexibility allows for greater freedom in product design and can lead to improved performance, reliability and efficiency.
Additionally, multilayer flex PCBs are ideal for applications that require the circuit board to bend or flex, while multilayer rigid PCBs are more suited for applications that require a stiff, rigid circuit board. Overall, the choice between multilayer flex and multilayer rigid PCBs will depend on the specific requirements of the application.
Welcome to our FAQ section, where we’ve compiled answers to many commonly asked questions. If you have any additional queries, please leave us a message.
These type of flex PCBs can have anywhere from 2 to 8 or more layers. The exact number of layers depends on the specific requirements of the application and the desired level of complexity for the circuit design.
We support the following stiffener options:
Polyimide: 0.20 mm to 0.75 mm
FR4: 0.15 mm to 2.0 mm
Formed Metal: 0.0075 mm to 1.0 mm
Yes. These type of flex PCBs manufactured in MV Flex Circuits are capable of supporting resistive foils. Examples are Constantan or Cupronickel resistive foils.
Yes, multilayer flex PCBs can have vias. Vias are small conductive pathways that connect different layers of a circuit board and allow for electrical signals to pass through the circuit. The vias are usually created by drilling small holes through the flexible substrate and filling them with a conductive material.
The available structure available is the IPC-6013 type 3, which the coverlay is bonded on both sides. It is bonded through an adhesiveless construction. It can contain more than 3 conductive layers. It can also contain PTH (Plated Through Holes). May have stiffener upon request.
