Ensuring maximum performance and reliability with FPC coverlay requires attention to detail and expertise in the manufacturing and design processes. Advanced quality control processes, proper material selection, and design for manufacturability are all essential factors to consider to achieve high-quality and reliable flexible circuits.
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When applying FPC coverlay to a flexible printed circuit board, there are several things to consider to ensure optimal performance and reliability. Some of the most important considerations include:
Adhesive Type: Different types of adhesives have different properties that can impact the adhesion, durability, and reliability of the circuit.
Peel Strength: The appropriate peel strength should be selected based on the flexibility and durability requirements of the circuit.
Material Type: FPC coverlay is available in a variety of materials, including polyimide and polyester.
Thickness: The thickness of the FPC coverlay can impact the flexibility and durability of the circuit.
Flexible printed circuit coverlay, or FPC coverlay, is a thin protective layer that is applied to the surface of a flexible printed circuit board. Its purpose is to provide protection and insulation to the circuitry, as well as improve its durability and reliability.
The coverlay is available in a variety of materials, including polyimide and polyester, and can be customized to meet the specific requirements of a project. Understanding the basics of coverlay is important for designing and manufacturing high-quality flexible printed circuit boards that can withstand the demands of their intended applications.
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FPC coverlay usually consists of adhesive and polyimide. Its thickness is indicated in this table.
|Name||Polyimide Thickness||Adhesive Thickness|
|13/15||13 (0.5) μm (mil)||15 (0.6) μm (mil)|
|13/25||13 (0.5) μm (mil)||25 (1.0) μm (mil)|
|25/25||25 (1.0) μm (mil)||25 (1.0) μm (mil)|
|25/35||25 (1.0) μm (mil)||35 (1.4) μm (mil)|
|25/50||25 (1.0) μm (mil)||50 (1.0) μm (mil)|
The size of the coverlay dam can also depend on the specific tolerances and requirements of the project. But commonly, it should be kept at 10 mils minimum.
Coverlay and soldermask are two different types of protective layers used in PCB manufacturing. Coverlay is a flexible layer applied to flexible circuit boards to enhance their durability and reliability, while soldermask is a rigid layer applied to rigid PCBs to protect the copper traces during soldering.
The thickness of FPC coverlay can vary depending on the specific requirements of a project. However, typical coverlay thicknesses range from 0.001 inches of polyimide and 0.001 inches adhesive.
FPC coverlay is typically made of flexible polymer materials, such as polyimide and polyester. These materials offer excellent thermal stability, high strength, and good electrical insulation properties.
The ratio 1:1 is the most common combination (that is 1 mil film and 1 mil adhesive).