MV Flex Circuit is a reliable supplier of high-quality FPC adhesive solutions, offering a wide range of options to ensure you find the perfect adhesive for your flex PCB project. With a focus on unmatched quality and excellent customer service, you can trust MV Flex Circuit.
MV Flex Circuit can help you get the best price if you send us your Gerber files. Our engineering team will provide a quotation within 1-2 hours. Even if we cannot provide the offer, our sales team will keep you informed of the status via email. Please don’t hesitate to contact us, as we are always here to help.
FPC adhesive is used to assemble and manufacture flexible printed circuit boards.
This adhesive is designed to provide a robust and reliable bond between the components and the board, ensuring optimal performance and functionality. The adhesive is formulated to work with various materials, including metals, plastics, and films commonly used in producing FPCs.
Additionally, This adhesive is available in various options, allowing for customization based on project-specific needs, such as thermal resistance, curing time, or flexibility.
This adhesive comes in different types, each with unique characteristics that make it suitable for specific applications.
The acrylic-based adhesive is popular due to its high bonding strength, excellent temperature resistance, and ability to withstand harsh environments.
Epoxy adhesive is known for its exceptional mechanical strength and durability. It is ideal for use in high-strength bonding applications.
Fluoropolymer adhesive, on the other hand, offers excellent chemical resistance, making it suitable for applications that involve exposure to harsh chemicals or solvents.
Welcome to our FAQ section, where we’ve compiled answers to many commonly asked questions. If you have any additional queries, please leave us a message.
Flexible circuit boards can be attached to other components or surfaces using different methods, including thermal bonding and pressure bonding.
Heat and pressure thermal bonding involve using heat and pressure to bond the FPC to other components or surfaces. The flexible circuit board is in contact with the surface or components, and heat and pressure are applied to create a strong bond. This method is often used in applications where a high degree of thermal stability is required.
On the other hand, pressure bonding involves using pressure alone to create a bond between the flexible circuit board and other components or surfaces. In this method, the flexible circuit board is placed in contact with the parts, and pressure is applied to create a strong bond.
This is a specially designed adhesive that bonds components to flexible printed circuit boards. It is necessary to ensure a strong, reliable bond that can withstand the rigors of use in flexible electronic devices.
Choosing the right adhesive for your project depends on various factors, including the materials being bonded, the application environment, and the required strength and flexibility of the bond. Consult with experts like MV Flex Circuit to determine which adhesive type is best suited for your project.
FPC adhesive can be customized to meet specific project requirements. Customizations can include adjustments to the adhesive’s curing time, flexibility, or temperature resistance. Consult with experts to learn more about custom solutions.
|Peel Strength||2.0 – 5.5||3-5||8-12||5-7|
|After Soldering||No change||No change||1-1.5x higher||variable|
|Low-Temperature Flex||all pass IPC-650 2-8.18@5+|
Yes, TESA tape can be used for FPC sheet bonding, provided the tape is compatible with the specific adhesive and the application requirements.
TESA tape is a double-sided adhesive tape that provides a safe bond and is often used in electronics assembly and manufacturing, including in FPC sheet bonding. However, ensuring that the tape is compatible with the FPC adhesive and the specific materials being bonded is essential.